Perfil de ChipMOS TECHNOLOGIES

Perfil de la empresa

La sede de ChipMOS TECHNOLOGIES está en Hsinchu City, Taiwán.

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, and internationally. It operates through five segments: Testing; Assembly; Display Panel Driver Semiconductor Assembly and Testing; Bumping; and Others. The company offers leadframe-based packages, such as the small outline package, thin small outline package, and quad flat package; and substrate-based packages, including FBGA, VFBGA, stacked chip-scale package, TFBGA, LGA, COG, and COF; and testing solutions comprising professional wafer and final testing, tester/tooling correlation, test program verification, engineering lot and pilot lot run arrangement, engineering support, device failure mode analysis, and automation system for simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC devices. It also provides bumping services; intellectual property management and enabling technologies; and turnkey services, such as wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment to display driver IC, memory IC, and logic mixed-signal IC. The company serves fabless companies, integrated device manufacturers, and foundries. ChipMOS TECHNOLOGIES INC. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

Descripción disponible en inglés.

Datos societarios

Sector

Tecnología

Industria

Semiconductors

País

Taiwán

Sede

No.1, Yanfa 1st Road, Hsinchu City

Cotización

8150 · TWSE

Divisa

TWD

Sitio web

chipmos.com