SJ Semiconductor

Profil de la société

SJ Semiconductor Corporation operates as an integrated circuit wafer-level advanced packaging and testing company in China and internationally. It focuses on the mid-stage silicon wafer processing and back-end advanced packaging segments of the integrated circuit advanced packaging and testing industry. It provides middle-end-of-line manufacturing and testing services, as well as develops advanced 3D Multi-Die integration technology and solutions. The company offers integrated circuit chips. Its products include bumping include copper pillar bump, copper pillar micro bump, copper-nickel-gold micro bumps, tin silver bumps, and ball implant bump; wafer testing; multi-chip integrated packaging. It provides mid-section bump, wafer testing, wafer-level chip packaging, and research and development services. The company was founded in 2014 and is based in Jiangyin, China.

Description disponible en anglais.

Informations sur la société

Secteur

Technologie

Industrie

Semiconductor Equipment & Materials

Pays

Chine

Siège

No. 9 Dongsheng West Road, 214437, Jiangyin

Salariés

6 726

Cotation

688820 · SSE

Devise

CNY

Site web

sjsemi.com